27pcs Universal BGA Stencils Kit - Direct Heat BGA Reballing Templates for Soldering & Welding Accessories | PCB Repair, Chip Reballing, Electronics Maintenance

feature:Made of high-quality 304 stainless steel plate, the thickness of the steel mesh is appropriate. Can be heated with a hot air blower, these templates are not easily deformed when heated.Cooperating with ordinary air guns, it can be used for manual ball filling, no need to purchase another ball filling platform.The area of the stencil matches the area of the BGA chip, which can reduce the waste of solder balls.However, this stencil is not suitable for chips with uneven arrangement of solder balls, or chips with different pitches.Reballing BGA ICs is quick and easy, and is a useful and economical accessory for BGA soldering.Specifications:Material: 304 stainless steelColor: as shownStencils specifications: as the pictureQuantity: 27 PCS/SetWeight: 60gPackage Included:27 x Universal StencilsImportant tips:1. Leaded solder ball melting point 183 degrees, alloy SN63PB37 (tin 63% lead 37%).2. Unleaded solder ball melting point 217 degrees Celsius. Alloy SN96.5 ag3cu0.5 (tin 96.5% silver 3% copper 0.5%).3. Some good solder ball and silver is normal. Melting point is normal.4.When heated directly with the air gun. Pay attention to adjusting air gun temperature. It doesn't need too high temperature. Otherwise, will result in the deformation of the stencils.

Made of high-quality 304 stainless steel plate, the thickness of the steel mesh is appropriate. Can be heated with a hot air blower, these templates are not easily deformed when heated.

Cooperating with ordinary air guns, it can be used for manual ball filling, no need to purchase another ball filling platform.

The area of the stencil matches the area of the BGA chip, which can reduce the waste of solder balls.

However, this stencil is not suitable for chips with uneven arrangement of solder balls, or chips with different pitches.

Reballing BGA ICs is quick and easy, and is a useful and economical accessory for BGA soldering.