Feature:1. Designed to maximize area in contact with cooling air.2. Can reduce the of hardware failure due to overheating.3. Stamped and formed by high-quality aluminum profile, with good thermal conductivity. Back with adhesive for simple installation.4. Back with adhesive for simple installation.5. Applicable for motherboard CPU, MOS module, transistor, power supply, electron tube, PCB power board, video memory, electrical, electronic components.Specification:Item Type: Heat SinkMaterial: 6063-T5 Extruded Aluminum ProfileColor: BlackMounting: Back with thermal conductive adhesive.w-e-text table td,.w-e-text table th,;.w-e-text table,Package List:20 x Heat Sink
